lnstruction

Ht50ym1-50 is a silica gel double-layer protective film, which is composed of brown PI substrate coated with silicon pressure-sensitive adhesive layer and coated with release film. It is suitable for bonding protection in high-temperature processes such as solder shielding of circuit board, gold-plated fingers of printed circuit board, hot-air tin hole processing and shielding in various stages of tin furnace.

Features

Good exhaust performance

 Low heating shrinkage, no curl after high temperature, no residual glue after stripping

 Excellent insulation performance

parameters

Applications